SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
20090811-A
PROD.
NAME
ABC'S DWG NO.
ABC'S ITEM NO.
MS20□□□□□□L□-□□□
MULTILAYER CHIP INDUCTOR
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
D
G
I
I
( PCB Pattern )
B
Unit : m/m
Series
A
B
C
D
G
H
I
MS2029
MS2022
2.00±0.20
2.00±0.20
1.20±0.20
1.20±0.20
0.90±0.20
1.20±0.20
0.50±0.30
0.50±0.30
1.0
1.0
1.0
1.0
1.0
1.0
Ⅱ﹒SCHEMATIC DIAGRAM：
a
b
c
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal：Cu/Sn
d﹒Remark：Products comply with RoHS' requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40 ---- +105℃
Peak Temp：260℃max.
b﹒Operating temp.：-55 ---- +125℃
c﹒Terminal Strength：
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
Temperature
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
F
+2.0 ~ 4.0℃
/ sec max.
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
250
200
150
100
50
Type
F ( kgf )
time ( sec )
230℃
50sec max.
MS2022
MS2029
0.8
0.6
30±5
70sec max.
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
0
50
100
150
Time ( seconds )
200
250
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
