SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
MH1608□□□□L□-□□□
ABC'S DWG NO.
ABC'S ITEM NO.
MULTILAYER CHIP INDUCTOR
Ⅰ CONFIGURATION & DIMENSIONS：
A
A
:
1.60±0.15
m/m
B
C
D
:
:
:
0.80±0.15
0.80±0.15
0.30±0.20
m/m
m/m
m/m
D
Ⅱ SCHEMATIC DIAGRAM：
Ⅲ FEATURES：
a
Monolithic structure ensuring high performance and reliability.
b
High frequency applications up to 6GHz.
c
Terminal：Ag/Cu/Ni/Sn
d
Remark：Products comply with RoHS' requirements
Ⅳ APPLICATIONS：
a
RF modules for telecommunication systems including
GSM, PCS,DECT,WLAN,Bluetooth,etc.
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
Temperature
Ⅴ GENERAL SPECIFICATION：
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
+2.0 ~ 4.0℃
a
Storage temp.：-55℃---- +125℃
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
-(1.0 ~ 5.0)℃ / sec max.
/ sec max.
Peak Temperature:
b
Operating temp.：-55℃ ---- +125℃
260℃
250
200
150
100
50
230℃
50sec max.
c
Solderability：Preheat 150℃. 60 sec
Solder：H63A
Solder temp.：230±5℃
Flux：Rosin
Dip time：4±1 sec
70sec max.
0
50
100
150
Time ( seconds )
200
250
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
