SPECIFICATION FOR APPROVAL
REF : 20090527-A
PROD.
PAGE: 2-2
ABC'S DWG NO.
ABC'S ITEM NO.
MB□□□□□□□□L□-□□□
HIGH CURRENT MULTILAYER
CHIP BEAD
NAME
Ⅴ﹒ELECTRICAL CHARACTERISTICS：
Impedance
(Ω)
at 100MHz
RDC
IDC
(A)
max.
DWG No.
(mΩ)
max.
MB3261190YL□ -□□□
MB3261260YL□ -□□□
MB3261310YL□ -□□□
MB3261500YL□ -□□□
MB3261800YL□ -□□□
19±25%
40
40
40
25
30
3.0
3.0
3.0
3.0
3.0
26±25%
31±25%
50±25%
80±25%
MB2029070YL□ -□□□
MB2029100YL□ -□□□
MB2029300YL□ -□□□
7±25%
10±25%
30±25%
30
30
25
3.0
3.0
3.0
MB1608300YL□ -□□□
30±25%
60
1.0
1). □：Paclaging Information… A：Bulk B：Taping Reel
2)."- ":Reference code
□□□
MB3261190YL□
MB3261260YL□
MB3261310YL□
MB3261500YL□
MB3261800YL□
MB2029070YL□
MB2029100YL□
MB2029300YL□
MB1608300YL□
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
