SPECIFICATION FOR APPROVAL
20070813-E
REF : 20070124-C
PAGE: 1
CM4532□□□□L□-□□□
PROD.
ABC'S DWG NO.
ABC'S ITEM NO.
WOUND CHIP INDUCTOR
NAME
Ⅰ CONFIGURATION & DIMENSIONS：
A
B
C
E
F
:
:
:
:
:
4.5±0.3
3.2±0.2
3.2±0.2
1.2
m/m
m/m
m/m
m/m
m/m
330K
Marking
Inductance code
4.2±0.2
+0.3
1.0
- 0
2.2
1.5
1.5
F
F
E
B
A
（ PCB Pattern ）
Ⅱ SCHEMATIC DIAGRAM：
d
a
Ⅲ MATERIALS：
a
b
c
d
e
Core：Ferrite DR core
c
Wire ：Enamelled copper wire (class H)
Terminal：Cu/Sn
Encapsulate：Epoxy novolac molding compound
Remark：Products comply with RoHS' requirements
b
Reflow profile
Peak Temp：250℃ max.
Ⅳ GENERAL SPECIFICATION：
Max time above 245℃ ：20~40sec max.
Max time above 217℃ ：60~150sec max.
200℃~250℃ Average Ramp-up Rate：3℃/second max.
a
b
c
d
e
f
Temp. rise ：20℃ max.
Temperature
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
6℃ / second max.
Ambient temp.：100℃ max.
Storage temp.：-40℃ ----+125℃
Operating temp.：-40℃----+125℃
Terminal pull strength：1.5 kg min.
Rated current：Current cause
150 ~ 200℃ / 60 ~ 180sec
Peak Temperature：
250℃
250
245
20~40sec
217
200
60~150sec
150
100
50
inductance drop within 10%
g
h
Resistance to solder heat：260℃.10 secs.
Resistance to solvent：Per MIL-STD-202F
0
50
100
150
Time ( seconds )
200
250
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
