SPECIFICATION FOR APPROVAL
REF : 20070124-C
PAGE: 1
CM3225□□□□L□-□□□
20080502-H
PROD.
NAME
ABC'S DWG NO.
ABC'S ITEM NO.
WOUND CHIP INDUCTOR
Ⅰ CONFIGURATION & DIMENSIONS：
A
B
C
E
F
:
:
:
:
:
3.2±0.4
2.5±0.2
2.2±0.2
1.0±0.2
m/m
m/m
m/m
m/m
100
Marking
+0.3
0.6
m/m
+0
Inductance code
-0
2.9±0.2
※ △K=∣ K1-K2∣ =0.25 m/m
1.8
1
1
K1 E K2
F
F
A
B
（ PCB Pattern ）
Ⅱ SCHEMATIC DIAGRAM：
d
Ⅲ MATERIALS：
a
c
a
b
c
d
e
Core：Ferrite DR core
Wire ：Enamelled copper wire (class H)
Terminal：Cu/Sn
Encapsulate：Epoxy novolac molding compound
Remark：Products comply with RoHS' requirements
b
Ⅳ GENERAL SPECIFICATION：
Reflow profile
Peak Temp：250℃ max.
a
b
c
d
e
f
Temp. rise ：20℃ max.
Max time above 245℃ ：20~40sec max.
Max time above 217℃ ：60~150sec max.
200℃~250℃ Average Ramp-up Rate：3℃/second max.
Ambient temp.：100℃ max.
Storage temp.：-40℃ ----+125℃
Operating temp.：-40℃----+125℃
Terminal pull strength：1.5 kg min.
Rated current：Current cause
Temperature
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
150 ~ 200℃ / 60 ~ 180sec
6℃ / second max.
Peak Temperature
：
250℃
250
245
20~40sec
217
200
60~150sec
150
100
50
inductance drop within 10%
Resistance to solder heat：260℃.10 secs.
Resistance to solvent：Per MIL-STD-202F
g
h
50
100
150
Time ( seconds )
200
250
0
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
