SPECIFICATION FOR APPROVAL
REF. :
CM3225□□□□L□-□□□
PAGE 1
ABC'S DWG NO.
PROD.
NAME
Wound Chip Inductor
REV.
20121109-L
Ⅰ﹒Configuration and dimensions：
100
Marking
Inductance code
A'
G
I
I
K1 E K2
B
F
F
A
（ PCB Pattern ）
+0
※ △K=∣K1-K2∣=0.25 m/m
Unit：m/m
A
A'
2.90 ±0.2
B
C
E
F
G
H
I
+0.3
-0
3.20 ±0.4
2.50 ±0.2
2.20 ±0.2
1.00 ±0.2
0.60
1.80
1.40
1.00
Ⅱ﹒Description：
a﹒Ferrite drum core construction.
b﹒Enamelled copper wire：H class
c﹒Product weight：0.05 g（ref.）
d﹒Moisture sensitivity Level 3
e﹒Products comply with RoHS' requirements
Reflow profile
Peak Temp：250℃ max.
Ⅲ﹒General Specification：
a﹒Temp. rise ：20℃ max.
Max time above 245℃ ：20~40sec max.
Max time above 217℃ ：60~150sec max.
200℃~250℃ Average Ramp-up Rate：3℃/second max.
Temperature
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
b﹒Ambient temp.：100℃ max.
c﹒Storage temp.：-40℃ ----+125℃
150 ~ 200℃ / 60 ~ 180sec
6℃ / second max.
Peak Temperature：
250℃
250
245
d﹒Operating temp.：-40℃----+125℃
20~40sec
217
200
(Temp. rise included)
60~150sec
150
100
50
e﹒Terminal pull strength：1.5 kg min.
f﹒Rated current：Current cause
inductance drop within 10%
g﹒Resistance to solder heat：250℃.10 secs.
h﹒Resistance to solvent：Per MIL-STD-202F
50
100
150
Time ( seconds )
200
250
0
AR-001C
ABC [ ABC Taiwan Electronics Corp ]
