SPECIFICATION FOR APPROVAL
REF : 20080718-A
PROD.
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
CM2520□□□□3□-□□□
WOUND CHIP INDUCTOR
NAME
Ⅰ﹒CONFIGURATION & DIMENSIONS:
A
B
C
E
F
:
2.5±0.2
2.0±0.1
1.8±0.1
1.4±0.1
0.40
m/m
m/m
m/m
m/m
m/m
A
:
:
:
:
Not Marking
0.9
1.5
0.9
F
F
E
( PCB Pattern )
Ⅱ﹒SCHEMATIC DIAGRAM:
d
Ⅲ﹒MATERIALS:
a
c
a﹒Core: Ferrite DR core
b ﹒Wire :Enamelled copper wire ( class F )
c﹒Terminal:Cu/Sn
b
d﹒Encapsulate:Epoxy novolac molding compound
e﹒Remark:Products comply with RoHS' requirements
Peak Temp:245℃ max.
Max time above 225℃ :30sec max.
Max time above 200℃ :50sec max.
Temp erature
Ⅳ﹒GENERAL SPECIFICATION:
a﹒Temp. rise :20℃ max.
R isin g Area
Preh eat Area
R eflo w Area
Forced Coolin g Area
b﹒Ambient temp.:80℃ max.
2 ~ 4℃ / sec
1 50 ~ 180 ℃ / 90 ~ 150 sec
2 ~ 4 ℃ / sec
3 ~ 5℃ / sec
240 ±5℃
c﹒Storage temp.:-40℃ ----+100℃
d﹒Operating temp.:-40℃----+85℃
e﹒Terminal strength:0.5 kg min.
f﹒Rated current:Current cause
250
200
150
100
50
10sec
30sec max.
20~30sec
(
)
inductance drop within 10%
g﹒Resistance to solder heat:260℃.10 secs.
h﹒Resistance to solvent:Per MIL-STD-202F
0
50
100
150
Time ( seconds )
200
250
AR-001A