SPECIFICATION FOR APPROVAL
REF : 20080718-A
PROD.
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
CM2520□□□□3□-□□□
WOUND CHIP INDUCTOR
NAME
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
B
C
E
F
:
2.5±0.2
2.0±0.1
1.8±0.1
1.4±0.1
0.40
m/m
m/m
m/m
m/m
m/m
A
:
:
:
:
Not Marking
0.9
1.5
0.9
F
F
E
（ PCB Pattern ）
Ⅱ﹒SCHEMATIC DIAGRAM：
d
Ⅲ﹒MATERIALS：
a
c
a﹒Core： Ferrite DR core
b ﹒Wire ：Enamelled copper wire ( class F )
c﹒Terminal：Cu/Sn
b
d﹒Encapsulate：Epoxy novolac molding compound
e﹒Remark：Products comply with RoHS' requirements
Peak Temp：245℃ max.
Max time above 225℃ ：30sec max.
Max time above 200℃ ：50sec max.
Temp erature
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Temp. rise ：20℃ max.
R isin g Area
Preh eat Area
R eflo w Area
Forced Coolin g Area
b﹒Ambient temp.：80℃ max.
2 ~ 4℃ / sec
1 50 ~ 180 ℃ / 90 ~ 150 sec
2 ~ 4 ℃ / sec
3 ~ 5℃ / sec
240 ±5℃
c﹒Storage temp.：-40℃ ----+100℃
d﹒Operating temp.：-40℃----+85℃
e﹒Terminal strength：0.5 kg min.
f﹒Rated current：Current cause
250
200
150
100
50
10sec
30sec max.
20~30sec
(
)
inductance drop within 10%
g﹒Resistance to solder heat：260℃.10 secs.
h﹒Resistance to solvent：Per MIL-STD-202F
0
50
100
150
Time ( seconds )
200
250
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
