SPECIFICATION FOR APPROVAL
REF : 20071102-D
PROD.
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
CC4532□□□□L□-□□□
WOUND CHIP INDUCTOR
NAME
Ⅰ﹒CONFIGURATION & DIMENSIONS:
A
B
C
E
F
:
:
:
4.5±0.3
3.2±0.2
3.2±0.2
1.2
m/m
m/m
m/m
m/m
m/m
330K
Marking
Inductance code
:
4.2±0.2
+0.3
:
1.0
-0
2.2
1.5
1.5
F
F
E
( PCB Pattern )
A
B
Ⅱ﹒SCHEMATIC DIAGRAM:
d
a
Ⅲ﹒MATERIALS:
c
a﹒Core:Ferrite DR core
b﹒Wire :Enamelled copper wire (class H)
c﹒Terminal:Cu/Sn
b
d﹒Encapsulate:Epoxy novolac
molding compound
e﹒Remark:Products comply with RoHS' requirements
Reflow profile
Peak Temp:250℃ max.
Max time above 245℃ :20~40sec max.
Max time above 217℃ :60~150sec max.
200℃~250℃ Average Ramp-up Rate:3℃/second max.
Ⅳ﹒GENERAL SPECIFICATION:
a﹒Temp. rise :20℃ max.
Temperature
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
b﹒Ambient temp.:100℃ max.
150 ~ 200℃ / 60 ~ 180sec
6℃ / second max.
c﹒Storage temp.:-40℃ ----+125℃
d﹒Operating temp.:-40℃----+125℃
e﹒Terminal pull strength:1.5 kg min.
f﹒Rated current:Current cause
Peak Temperature:
250℃
250
245
20~40sec
217
200
60~150sec
150
100
50
inductance drop within 10%
g﹒Resistance to solder heat:260℃.10 secs.
h﹒Resistance to solvent:Per MIL-STD-202F
0
50
100
150
Time ( seconds )
200
250
AR-001A