SPECIFICATION FOR APPROVAL
20080131-D
REF : 20070313-B
PAGE: 1
CC3225□□□□L□-□□□
PROD.
NAME
ABC'S DWG NO.
ABC'S ITEM NO.
WOUND CHIP INDUCTOR
Ⅰ CONFIGURATION & DIMENSIONS：
A
B
C
E
F
:
:
:
:
3.2±0.4
2.5±0.2
2.2±0.2
m/m
m/m
m/m
m/m
m/m
+0
100
Marking
1.0±0.2
+0.3
Inductance code
2.9±0.2
:
0.6
- 0
※ △K=∣ K1-K2∣ =0.25 m/m
1.8
1
1
F
F
K1
E K2
B
A
（ PCB Pattern ）
Ⅱ SCHEMATIC DIAGRAM：
d
a
c
Ⅲ MATERIALS：
a
b
c
d
e
Core：Ferrite DR core
Wire ：Enamelled copper wire (class H)
Terminal：Cu/Sn
Encapsulate：Epoxy novolac molding compound
b
Remark：Products comply with RoHS'
requirements
Reflow profile
Ⅳ GENERAL SPECIFICATION：
Peak Temp：250℃ max.
Max time above 245℃ ：20~40sec max.
Max time above 217℃ ：60~150sec max.
a
b
c
d
e
f
Temp. rise ：20℃ max.
200℃~250℃ Average Ramp-up Rate：3℃/second max.
Temperature
Rising Area
Ambient temp.：100℃ max.
Storage temp.：-40℃ ----+125℃
Operating temp.：-40℃----+125℃
Terminal pull strength：1.5 kg min.
Rated current：Current cause
Preheat Area
Reflow Area
Forced Cooling Area
6℃ / second max.
150 ~ 200℃ / 60 ~ 180sec
Peak Temperature
：
250℃
250
245
20~40sec
217
200
60~150sec
150
100
50
inductance drop within 10%
g
h
Resistance to solder heat：260℃.10 secs.
Resistance to solvent：Per MIL-STD-202F
0
50
100
150
Time ( seconds )
200
250
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
