SPECIFICATION FOR APPROVAL
REF : 20070320-A
PROD.
PAGE: 1
CB5009□□□□L□-□□□
ABC'S DWG NO.
ABC'S ITEM NO.
SMD POWER INDUCTOR
NAME
Ⅰ CONFIGURATION & DIMENSIONS：
A
A : 5.60±0.15
m / m
m / m
m / m
m / m
m / m
m / m
m / m
m / m
B : 6.00 max.
C : 0.90±0.10
D : 1.50±0.30
E : 1.40±0.20
F : 2.00 ref.
G : 6.00 ref.
H : 1.50 ref.
4R7
E
G
H
(PCB Pattern Suggestion)
Ⅱ SCHEMATIC DIAGRAM：
Ⅲ MATERIALS：
a
c
b
d
a
Core：Ferrite core
Peak Temp：260℃ max.
b
c
d
e
Wire：Enamelled copper wire
Base：Cu/Ag(1.0um)
Adhesive：Epoxy resin
Remark：Products comply with RoHS'
requirements
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
Temperature
Rising Area
Preheat Area
Reflow Area
+2.0 ~ 4.0℃
Forced Cooling Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
250
200
150
100
50
230℃
50sec max.
Ⅳ GENERAL SPECIFICATION：
a
b
c
Temp. rise ：40℃ typ.
70sec max.
Storage temp.：-40℃ ----+120℃
Operating temp.：-40℃----+125℃
(included Temp. rise)
50
100
150
Time ( seconds )
200
250
0
d
Resistance to solder heat：260℃.10 secs.
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
