SPECIFICATION FOR APPROVAL
REF : 20080424-A
PROD.
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
AL1608□□□□L□-□□□
THIN FILM CHIP INDUCTOR
NAME
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
D
G
I
I
B
( PCB Pattern )
Unit : m/m
Series
A
B
C
D
G
H
I
AL1608
1.60±0.10
0.80±0.10
0.45±0.10
0.30±0.20
0.9
0.9
0.6
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Body：Ceramic
a
b
c
b﹒Internal conductor：Cu
c﹒Terminal electrode：Cu/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40℃ ---- +105℃
b﹒Operating temp.：-55℃ ---- +125℃
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
Temperature
c﹒Terminal strength：
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
+2.0 ~ 4.0℃
/ sec max.
F
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
250
200
150
100
50
Type
F ( kgf )
0.5
Time ( sec )
230℃
50sec max.
AL1608
30±5
70sec max.
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
0
50
100
150
Time ( seconds )
200
250
Dip time : 4±1 seconds
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
