AD8274
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Maximum Voltage at Any Input Pin
Minimum Voltage at Any Input Pin
Storage Temperature Range
Specified Temperature Range
Package Glass Transition Temperature (T
G
)
Rating
±18 V
−V
S
+ 40 V
+V
S
– 40 V
−65°C to +150°C
−40°C to +85°C
150°C
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8274 is limited
by the associated rise in junction temperature (T
J
) on the die. At
approximately 150°C, which is the glass transition temperature,
the properties of the plastic change. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 150°C for an
extended period may result in a loss of functionality.
2.0
T
J
MAX = 150°C
MAXIMUM POWER DISSIPATION (W)
1.6
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.2
SOIC
θ
JA
= 121°C/W
MSOP
θ
JA
= 135°C/W
THERMAL RESISTANCE
The θ
JA
values in Table 4 assume a 4-layer JEDEC standard
board with zero airflow.
Table 4. Thermal Resistance
Package Type
8-Lead MSOP
8-Lead SOIC
θ
JA
135
121
Unit
°C/W
°C/W
0.8
0.4
07362-004
0
–50
–25
0
25
50
75
100
125
AMBIENT TEMERATURE (°C)
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
SHORT-CIRCUIT CURRENT
The AD8274 has built-in, short-circuit protection that limits the
output current (see Figure 16 for more information). While the
short-circuit condition itself does not damage the part, the heat
generated by the condition can cause the part to exceed its
maximum junction temperature, with corresponding negative
effects on reliability. Figure 2 and Figure 16, combined with
knowledge of the part’s supply voltages and ambient temperature,
can be used to determine whether a short circuit will cause the
part to exceed its maximum junction temperature.
ESD CAUTION
Rev. C | Page 4 of 16
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