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7148DG 参数 Datasheet PDF下载

7148DG图片预览
型号: 7148DG
PDF下载: 下载PDF文件 查看货源
内容描述: 与折叠鳍频道风格散热片 [Channel style heat sink with folded back fins]
分类和应用: 散热片
文件页数/大小: 116 页 / 8734 K
品牌: AAVID [ AAVID THERMALLOY, LLC ]
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How To Select a Heat Sink  
How to select a heat sink  
The basic equation for heat transfer or power dissipation may be stated as follows:  
Δ T  
P =  
D
ΣR  
θ
Where:  
P
the power dissipated by the semiconductor device in watts.  
D =  
ΔT = the temperature difference of driving potential which causes the flow of heat.  
ΣR = the sum of the thermal resistances of the heat flow path across which ΔT exists.  
θ
The above relationship may be stated in the following forms:  
T –T  
J
T –T  
T –T  
A
C
A
R
S
R
A
P
=
P
=
P =  
D
D
D
R
R
R
R
θJC + θCS + θSA  
θCS + θSA  
θSA  
Where:  
T = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).  
J
T = case temperature of the semiconductor device in °C.  
C
T = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.  
S
T
= ambient air temperature in °C.  
A
R
R
R
= thermal resistance from junction to case of the semiconductor device in °C per watt  
θJC  
(usually stated by manufacturer of semiconductor device).  
= thermal resistance through the interface between the semiconductor device  
θCS  
θSA  
and the surface on which it is mounted in °C per watt.  
= thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.  
The above equations are generally used to determine the required thermal resistance of the heat sink (R  
),  
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.  
θSA  
The common practice is to represent the system with  
Figure 1 indicates the location of the various heat  
flow paths, temperatures and thermal resistances.  
a network of resistances in series as shown in Figure 2.  
FIGURE 1  
FIGURE 2  
Mounting surface  
(cooler/dissipator)  
Atmosphere  
or ambient  
Interface  
T
A
Junction  
(heat source)  
T
T
T
T
A
J
C
S
P
P
D
D
Semiconductor case  
R
R
R
θJC  
θCS  
θSA  
R
R
θCS  
θSA  
Heat flow path mounting  
surface to ambient, equation (3)  
T
S
R
Heat flow path case  
θJC  
to ambient equation (2)  
T
C
Heat flow path junction  
to ambient, equation (1)  
T
T
J
A
USA Tel: +1 (603) 224-9988 email: info@aavid.com  
Italy Tel: +39 051 764011 email: sales.it@aavid.com  
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg  
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AMERICA  
EUROPE  
ASIA  
9
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com  
www.aavidthermalloy.com  
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