BGA–Tape Attachment
Heat sinks for plastic BGA packages
"H"
"L"
"W"
Pressure sensitive, thermally conductive adhesive tape
easily and reliably bonds a heat sink to an integrated
circuit package. Tapes provide high thermal conductiv-
ity and exceptional bonding properties. Adhesives are
formulated for plastic and metal/ceramic packages.
Material: Aluminum
ORDERING INFORMATION
IC Pkg. Size (mm) IC Pkg. Style
Part Number
375324B00035G
375424B00034G
374024B00035G
374124B00035G
374224B00035G
335224B00034G
374324B00035G
374424B00035G
374524B00035G
373024B00034G
2327B-CP50G
“W” (mm)
10.20
15.20
23.00
23.00
23.00
25.00
27.00
27.00
27.00
27.90
27.90
30.00
35.00
35.00
35.00
35.00
35.00
40.00
40.10
40.00
40.00
“L” (mm) “H” (mm)
θn2
θf3
21.20
17.60
11.69
7.39
6.370
10.39
9.35
6.46
5.47
10.00
7.43
9.11
9.67
7.55
5.15
4.27
4.28
6.46
6.02
4.34
3.83
Finish
Tape code1
10 x 10
15 x 15
23 x 23
23 x 23
23 x 23
25 x 25
27 x 27
27 x 27
27 x 27
28 x 28
28 x 28
31 x 31
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
40 x 40
40 x 40
40 x 40
40 x 40
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
10.20
15.20
23.00
23.00
23.00
25.00
27.00
27.00
27.00
27.90
28.10
30.00
35.00
35.00
35.00
35.00
35.00
40.00
40.00
40.00
40.00
10.20
6.40
71.40
62.50
40.00
23.40
19.70
34.00
30.60
20.30
16.50
33.30
23.40
29.40
31.90
23.40
15.30
12.00
11.90
20.30
18.40
12.20
10.30
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
35
34
35
35
35
34
35
35
35
34
34
34
34
35
35
35
34
35
34
35
35
10.00
18.00
25.00
9.90
10.00
18.00
25.00
8.90
15.20
9.40
335824B00034G
371824B00034G
374624B00035G
374724B00035G
374824B00035G
372024B00034G
374924B00035G
364424B00034G
375024B00035G
375124B00035G
7.00
10.00
18.00
25.00
27.90
10.00
11.40
18.00
25.00
1. For tape specifications see page 88
2. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
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