TO-220 & TO-218 & TO-247 Heat Sinks
Grease
&
Mounting
Kits
page 99
5301 High rise style heat sink features twisted fins and Wave-OnTM solderable mounts
Epoxy
page112
BASE PART
FIGURE A
FIGURE B
30.61
(1.205)
30.61
(1.205)
12.70
(0.500)
12.70
(0.500)
10.16
(0.400)
24.13
(0.950)
44.45
4.06
(0.160)
TYP
4.06
(0.160)
TYP
CLIP 62
CLIP 50
6.60
(0.260)
6.60
(0.260)
(1.750)
ø
3.20
(0.126)
THRU
ø
x
0.76
(0.030)
(0.110)
x
0.76
(0.030)
2.79
2.79
Ø
High rise style heat sink features
twisted fins and Wave-OnTM solder-
able mounts for easy attachment
to the PC card. Models include thru
holes on one side to attach devices
using standard hardware and dittins
with special slots on the other for
easy device attachment using a con-
venient spring clip. Dual models use
two dittins and clips to locate and
attach devices.
(0.110)
44.45
(1.750)
HIGH DITTIN
2X HIGH DITTIN
7.50
1.57
(0.062)
1.57
(0.062)
"A"
(0.295)
7.62
(0.300)
2.54
(0.100)
2.54
(0.100)
2.54
(0.100)
12.45
(0.490)
12.45
(0.490)
3.00
(0.118)
3.48
(0.137)
4.24
(0.167)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
14.99
(0.590)
14.99
(0.590)
Air Velocity—Feet Per Minute
400
600 800
0
200
1000
100
80
5
4
3
2
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
Description
Device
Figure
“A” Dim
60
530101B00100G Heat sink twisted fin
530101B00150G With device clip #50
530102B00100G Heat sink twisted fin
530102B00150G With device clip #50
530161B00162G With two device clips #62
530162B00162G With two device clips #62
TO-218, TO-247
TO-218, TO-247
TO-220
21.08 (0.830)
21.08 (0.830)
18.29 (0.720)
18.29 (0.720)
21.08 (0.830)
18.29 (0.720)
4.75 (0.187)
4.75 (0.187)
4.75 (0.187)
4.75 (0.187)
4.75 (0.187)
4.75 (0.187)
40
A
1
0
20
0
TO-220
A
B
B
0
4
8
12
16
20
Dual TO-218, TO-247
Dual TO-220
Heat Dissipated—Watts
530161 or 530162
530101 or 530102
For additional options see page 82
Grease
&
Mounting
Kits
page 99
Epoxy
5308 High rise style heat sink features twisted fins and solderable tabs
page112
BASE PART
FIGURE A
FIGURE B
ø
2.95 THRU 2x
(0.116)
RECOMMENDED
HOLE PATTERN
43.13
(1.698)
30.61
(1.205)
30.61
(1.205)
12.70
(0.500)
12.70
(0.500)
45.72
(1.800)
CLIP 50
CLIP 62
4.06
(0.160)
TYP
4.06
(0.160)
TYP
6.60
(0.260)
6.60
(0.260)
High rise style heat sink features
twisted fins and solderable tabs
for easy attachment to the PC card.
Models include thru holes on one
side to attach devices using stan-
dard hardware and dittins with
special slots on the other for easy
device attachment using a conven-
ient spring clip. Dual models use
two dittins and clips to locate and
attach devices.
ø
3.20
(0.126)
x
ø
2.79 0.76
ø
0.76
2.79 X
(0.030)
44.45
(1.750)
(0.110) (0.030)
HIGH DITTIN
(0.110)
2X HIGH DITTIN
7.62
(0.300)
"A"
10.16
(0.400)
14.99 14.99
12.45
(0.490)
12.45
(0.490)
2.54
(0.100)
3.00
(0.118)
(0.590)
(0.590)
3.48
(0.137)
22.90
(0.900)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
46.74
(1.841)
Air Velocity—Feet Per Minute
0
200
400
600
800
1000
100
80
5
4
3
2
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
Description
Device
Figure
“A” Dim
60
530801B05100G Heat sink twisted fin and solderable tabs
530801B05150G With device clip #50
TO-218, TO-247
TO-218, TO-247
TO-220
21.08 (0.830)
21.08 (0.830)
18.29 (0.720)
18.29 (0.720)
21.08 (0.830)
18.29 (0.720)
2.95 (0.116)
2.95 (0.116)
2.95 (0.116)
2.95 (0.116)
2.95 (0.116)
40
A
1
0
20
0
530802B05100G Heat sink twisted fin and solderable tabs
530802B05150G With device clip #50
TO-220
A
B
B
0
4
8
12
16
20
530861B05162G With two device clips #62
530862B05162G With two device clips #62
Dual TO-218, TO-247
Dual TO-220
Heat Dissipated—Watts
2.95 (0.116)
530861 or 530862
530801 or 530802
For additional options see page 82
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