Interface Material/Pads
Hi-Flow®*
TO-3
TO-218
TO-220
Aavid Thermalloy has added a phase change
pad to its line-up. These pads provide low
thermal resistance and electrical isolation
for low pressure spring mount applications.
Above the phase change temperature the
material flows to fill in surface irregularities
and maximize the heat conduction path.
ø
2X 3.56
(0.140)
18.80
12.70
(0.500)
(0.740)
2.69
(0.160)
DIA
3.73
(0.147)
DIA
41.91
(1.650)
21.84
(0.860)
19.05
(0.750)
16.76
(0.660)
14.30
(0.563)
ø
2.36
(0.093)
2X
28.96
(1.140)
MATERIAL PROPERTIES
ORDERING INFORMATION
example 12 digit part
530101B _ 5150G
Reinforcement carrier
Polymide
Ordering code
Thickness
0.127 (0.005)
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used. To order
additional Hi-Flow® pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Continuous use temp (°C)
Phase change temp(°C)
Dielectric breakdown voltage (Vac)
Dielectric constant (1000 Hz)
Volume resistivity (Ohm-meter)
150
55
5000
4.5
1012
Ordering code Description
0
7
8
No pads
Thermal impedance vs. pressure
Pressure
One Hi-Flow® pad
Two Hi-Flow® pads
10
25
50
200
1.1
TO-220 Thermal performance (ºC/W)
1.15
1.14
1.12
*
Hi-Flow® is a registered trademark of the Bergquist Company
Alignment Pads
Solderable alignment pads are an innovative
way to attach the heat sink to your transistor that
could cut your assembly time by more than half.
Alignment pads provide cost effective solderability,
while providing numerous additional benefits.
Alignment pads are factory applied and can be
bought separately as well. Please refer to accessory
Index D on page 85.
Figure A
Figure B
30.48
(1.200)
7.62
(0.300)
13.21
(0.520)
11.68
(0.460)
20.07
(0.790)
17.02
(0.670)
21.84
(0.860)
25.02
(0.985)
5.08
(0.200)
21.84
(0.860)
0.76
(0.030)
ORDERING INFORMATION
0.76
example
Thermalloy origin part
(0.030)
0.51
(0.020)
3.10
(0.122)
25.40
3.25
(0.128)
7022B–8223–CL03 G
3.18
5.08
(0.200)
14.22
(0.560)
(0.125)
TYP THK
A
B
C
9.40
(0.370)
(1.000)
A = Model number
B = Alignment pad
C = RoHS compliant
Suffix
Device
Figure
8223-CL03G TO-220
8241-CL11G TO-218
B
A
Typical installation
Shown with part number 8241-CL11
Recommended hole pattern for 8223-CL03G
Recommended hole pattern for 8241-CL11G
PLATED THRU HOLE PER
2.95
DIA PLATED
THRU HOLE
2.95
(0.116)
DIA PLATED
THRU HOLE
TYP(2)
DEVICE MANUFACTURERS
(0.116)
1.60
(0.063)
DIA PLATED
THRU HOLE
TYP(3)
RECOMMENDATION
2.54
(0.100)
2.54
(0.100)
5.46
(0.215)
5.46
(0.215)
7.37
(0.290)
1
C
L
12.70
(0.500)
CLIP ASSEMBLY
14.73
(0.580)
25.40
(1.000)
USA Tel: +1 (603) 224-9988 email: info@aavid.com
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Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
EUROPE
ASIA
87
www.aavidthermalloy.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com