Standard Products Found
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Thermal Performance
*θn **θf
12.2 4.34
*Natural convection thermal resistance is based on a 75 °C heat sink temperature rise.
**Forced convection thermal resistance based on an entering 1.0 m/s (200 lfm) airflow.
Due to various heat dissipation paths within a BGA device, please test the heat sink in your application.
This data sheet represents only one of a broad range of products we make to cool electronics.
Our representatives can help you configure a complete cooling solution for your individual applications.
Visit us at www.aavidthermalloy.com • info@aavid.com • ©2002 Aavid Thermalloy, LLC
http://www.aavidthermalloy.com/bin/bga_disp_print.pl?partnum=037815&attach=&size=... 2/25/2003
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