5/15/12
373324M00000G - heatsinks for BGA Devices
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BGA Heat Sinks
373324M00000G
Pin Fin heat sink with epoxy attachment
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Features
Epoxy attachment
Pin Fin array allows omni-directional airflow to maximize heat dissipation
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Width: 37.40
Length: 37.40
Height: 6.00
Base Thickness: 1.30
Fin Thickness: Length 1.40, Width 1.30
# of Fins: Length 8, Width 8
Fin Tip to Tip: 0.00
Finish: Green Anodize
Thermal Performance
Natural Convection: 0.00
(based on a heatsink temperature rise of 75°C above ambient)
Forced convection: 0.00
based on fully ducted airflow entering at 1.0 m/s (197 LFM).
https://www.aavid.com/products/bga/373324m00000g
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