21/05/2012
371924B00034G - heatsinks for BGA Devices
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BGA Heat Sinks
371924B00034G
Pin Fin heat sink with tape attachment
RoHS: compliant
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Features
Tape mounting saves board space by eliminating mounting holes
Convenient peel and stick assembly is quick and clean
Pin Fin array allows omni-directional airflow to maximize heat dissipation
This part comes with T410R Chomerics Tape for Plastic surfaces
Thermal Resistance: 1.10
Adhesive: Silicone
Color: White
Carrier: Aluminum
Meets Aavid RoHS 9000
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Width: 35.00
Length: 35.00
Height: 14.00
Base Thickness: 2.03
Fin Thickness: Length 1.14, Width 0.90
# of Fins: Length 11, Width 11
Fin Tip to Tip: 0.00
Finish: Black Anodize
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