21/05/2012
364424B00000G - heatsinks for BGA Devices
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BGA Heat Sinks
364424B00000G
Pin Fin heat sink with epoxy attachment
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Features
Epoxy attachment
Pin Fin array allows omni-directional airflow to maximize heat dissipation
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Width: 40.00
Length: 40.00
Height: 11.40
Base Thickness: 2.54
Fin Thickness: Length 0.90, Width 1.02
# of Fins: Length 13, Width 13
Fin Tip to Tip: 0.00
Finish: Black Anodize
Thermal Performance
Natural Convection: 0.00
(based on a heatsink temperature rise of 75°C above ambient)
Forced convection: 0.00
based on fully ducted airflow entering at 1.0 m/s (197 LFM).
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