STANDARD HEAT SINKS FOR BALL GRID ARRAY APPLICATIONS
ORDERING INFORMATION FOR OTHER POPULAR BGA HEAT SINKS:
Aavid Part Number
335114B00000
335124B00032
335214B00000
335214B00032
335224B00032
335314B00000
335314B00032
373024B00000
335514B00000
335714B00000
335714B00032
335724B00000
335724B00032
335814B00000
335814B00032
335824B00032
373114B00032
336314B00000
336314B00032
336614B00000
336614B00032
336714B00000
362914B00000
363014B00000
W
24.1
24.1
25.0
25.0
25.0
27.0
27.0
27.9
28.4
30.1
30.1
30.1
30.1
30.1
30.1
30.1
33.0
36.1
36.1
38.1
38.1
40.0
49.8
49.8
L
24.1
24.1
25.0
25.0
25.0
27.0
27.0
27.9
28.4
30.1
30.1
30.1
30.1
30.1
30.1
30.1
33.0
36.1
36.1
38.1
38.1
40.0
49.8
49.8
H
23.7
23.7
10.0
10.0
10.0
11.4
11.4
8.9
15.2
7.0
7.0
7.0
7.0
9.4
9.4
9.4
12.7
17.0
17.0
16.0
16.0
19.1
25.4
30.5
θsa@
200
˚C/W LFM
8.8
7.9
18.0
18.0
16.5
9.0
9.0
12.1
7.9
15.0
15.0
13.6
13.6
10.5
10.5
9.0
8.1
7.3
7.3
5.1
5.1
7.6
2.6
2.4
Fig. #
1
2
1
1
2
1
1
2
1
1
1
2
2
1
1
2
1
1
1
1
1
1
1
1
Added Features*
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
All
part numbers shown specify anodized finish. All dimensions are nominal and shown in millimeters.
*1070 tape recommended for ceramic or metal packages. Use epoxy or T410 for plastic packages.
Figure 1: Straight-Fin Heat Sink
Figure 2: Cross-Cut Heat Sink
Assembly Time
Pressure
Temperature
22˚C
50˚C
10 psi
15 sec 5 sec
30 psi
5 sec
3 sec
INSTALLATION PROCEDURE FOR THER-A-GRIP 1070:
Step 1
:
Make sure the chip surface is clean and free from any possible contaminants.
Wipe surface with industrial solvent, e.g., isopropyl alcohol, acetone.
Step 2:
Peel off the blue mylar embossed liner from the tape. Center the heat sink on the chip
and apply one of the following recommended temperature/pressure options:
AAVID [ AAVID THERMALLOY, LLC ]
