21/05/2012
341900F00000G - heatsinks for BGA Devices
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BGA Heat Sinks
341900F00000G
Low profile copper heat sink for PCI and AGP chip
sets
Qty in stock:
When space is at a premium, Aavid’s Thin-fin heat
sinks reduce package case temperature by as
much as 20ºC. These flexible, copper spreaders
attach to the electronic package using pre-applied
adhesive, providing an off-theshelf solution for PCI
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estore@aavid.com
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and AGP chip sets. A laminated dielectric coating
prevents shorting,making the Thin Fin ideal for BGA devices and multimedia applications.
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Width: 25.40
Length: 76.20
Height: 0.00
Thermal Performance
(based on a heatsink temperature rise of 75°C above ambient)
based on fully ducted airflow entering at 1.0 m/s (197 LFM).
Thermal Curve:
https://www.aavid.com/products/bga/341900f00000g
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