BGA – Bi Directional
Bi Directional
"W"
"L"
"H"
Designed for applications with airflow traveling
in a single direction, these heat sinks are suitable
for a variety of standard square IC packages.
Models are available with pre-applied thermal
tape for easy attachment to the IC. Epoxy attach
models are also available.
Material: Aluminum
ORDERING INFORMATION
IC Pkg Size
10 X 10
10 X 10
24 X 24
25 X 25
25 X 25
25 X 25
25 X 25
25 X 25
27 X 27
27 X 27
27 X 27
28 X 28
30 X 30
30 X 30
30 X 30
30 X 30
37.5 X 37.5
37.5 X 37.5
IC Pkg Style
All
Part Number
615653B00250G
709203B00400G
335114B00032G
335214B00032G
335211B00032G
335214B00000G
335211B00000G
335214B00034G
335314B00035G
335314B00032G
335314B00000G
700353U01100G
335814B00000G
335714B00000G
335814B00032G
335714B00032G
799403B01500G
336314B00000G
“W” (mm)
6.00
“L” (mm)
6.00
“H” (mm)
5.00
θn3
142.58
55.98
13.60
10.00
10.00
10.00
10.00
10.00
10.00
10.00
10.00
18.49
10.50
15.20
9.20
θf4
76.26
29.94
7.27
5.35
5.35
5.35
5.35
5.35
5.35
5.35
5.35
9.89
5.61
8.13
4.92
8.13
6.53
5.88
Finish
Attachment Tape Code 2
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Unfinished
Epoxy1
Epoxy1
Tape
N/A
N/A
32
All
10.00
24.00
25.00
25.00
25.00
25.00
25.00
27.00
27.00
27.00
28.00
30.00
30.00
30.00
30.00
38.00
36.00
10.00
24.00
25.00
25.00
25.00
25.00
25.00
27.00
27.00
27.00
28.00
30.00
30.00
30.00
30.00
38.00
36.00
10.00
24.00
10.00
10.00
10.00
10.00
10.00
11.00
11.00
11.00
9.00
Metal
Metal
Metal
All
Tape
32
Tape
32
Epoxy1
Epoxy1
Tape
N/A
N/A
34
All
Plastic
Plastic
Metal
All
Tape
35
Tape
32
Epoxy1
Epoxy1
Epoxy1
Epoxy1
Tape
N/A
N/A
N/A
N/A
32
All
All
9.00
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
Black anodize
All
7.00
Metal
Metal
All
9.00
7.00
15.20
12.21
11.00
Tape
32
10.00
17.00
Epoxy1
Epoxy1
N/A
N/A
All
1. Epoxy ordered separately for information on Epoxy see page 114,115.
2. For tape specifications see page 88.
3. Natural convection thermal resistance based on a 75°C heat sink temperature rise.
4. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
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