6/5/2015
1053290145C1R0G heatsinks for BGA Devices
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management solutions.
10-53290145-C1-R0G
Straight Fin Heat Sink w/ maxiGRIP
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Features
Maxigrip tool
High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments
maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and
Unpackaged Drop Testing standards
Comes preassembled with high performance, phase changing, thermal interface material
The Fine Print
http://www.aavid.com.cn/products/bga/1053290145c1r0g
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