Advanced Analog Technology, Inc.
PACKAGE DIMENSION (CONT.)
DIMENSIONS IN MILLIMETERS DEMINSIONS IN INCHES
SYMBOLS
MIN
1.05
0.05
1.00
0.25
0.25
0.08
0.08
2.70
2.60
1.50
0.35
TYP
1.20
MAX
1.35
0.15
1.20
0.50
0.45
0.20
0.15
3.00
3.00
1.70
0.55
MIN
0.041
0.002
0.039
0.010
0.010
0.003
0.003
0.106
0.102
0.059
0.014
TYP
0.047
0.004
0.043
------
MAX
0.053
0.006
0.047
0.020
0.018
0.008
0.006
0.118
0.118
0.067
0.022
A
A1
A2
b
0.10
1.10
------
0.40
b1
c
0.016
------
------
0.11
c1
D
0.004
0.114
0.110
0.063
0.018
0.024 REF
0.037 BSC
0.075 BSC
5ο
2.90
E
2.80
E1
L
1.60
0.45
L1
e
0.60 REF
0.95 BSC
1.90 BSC
5ο
e1
0ο
3ο
6ο
10ο
7ο
0ο
3ο
6ο
10ο
7ο
θ
θ1
θ2
5ο
5ο
8ο
10ο
8ο
10ο
NOTE:
1. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.20 MILLIMETERS PER SIDE.
2. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.20MILLIMETERS PER SIDE.
3. THE PACKAGE TOP MAY BE SAMLLER THAN PACKAGE BOTTOM.
DIMENSION D AND E1 ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, INTERLEAD FLASH AND GATE BURRS, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE MOLDED BODY.
4. THE SECTION B-B APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 MILLIMETERES AND
0.15 MILLIMETERS FROM THE LEAD TIP
5. LEAD FRAME MATERIAL: EFTEC-64T 1/2H OR H.
– 台灣類比科技股份有限公司 –
– Advanced Analog Technology, Inc. –
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