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AAT3688IWP-4.2-T1 参数 Datasheet PDF下载

AAT3688IWP-4.2-T1图片预览
型号: AAT3688IWP-4.2-T1
PDF下载: 下载PDF文件 查看货源
内容描述: USB接口锂离子/聚合物电池充电器 [USB Port Lithium-Ion/Polymer Battery Charger]
分类和应用: 电池
文件页数/大小: 23 页 / 545 K
品牌: AAT [ ADVANCED ANALOG TECHNOLOGY, INC. ]
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AAT3688  
USB Port Lithium-Ion/Polymer Battery Charger  
the AAT3688 status data control will reply the data  
word back to the system microcontroller after a  
delay specified by the data report time specification  
TDATA(RPT). The period of the following group of data  
pulses will be specified by the TDATA specification.  
Data Timing  
The system microcontroller should assert an active  
low data request pulse for minimum duration of  
200ns; this is specified by TLO(DATA). Upon sensing  
the rising edge of the end of the data request pulse,  
Timing Diagram  
SQPULSE  
PDATA  
SQ  
System Reset  
System Start  
CK  
TSYNC  
TLAT  
TOFF  
Data  
TDATA(RPT) = TSYNC + TLAT < 2.5 PDATA  
TOFF > 2 PDATA  
N=3  
N=1  
N=2  
Where:  
Thermal Considerations  
The AAT3688 is packaged in a Pb-free, 3x3mm  
TDFN package which can provide up to 2.0W of  
power dissipation when it is properly bonded to a  
printed circuit board and has a maximum thermal  
resistance of 50°C/W. Many considerations should  
be taken into account when designing the printed  
circuit board layout, as well as the placement of the  
charger IC package in proximity to other heat gen-  
erating devices in a given application design. The  
ambient temperature around the charger IC will  
also have an affect on the thermal limits of a bat-  
tery charging application. The maximum limits that  
can be expected for a given ambient condition can  
be estimated by the following discussion.  
PD = Total Power Dissipation by the Device  
VIN = Input Voltage Level, VUSB  
VBAT = Battery Voltage as Seen at the BAT Pin  
ICC = Maximum Constant Fast Charge Current  
Programmed for the Application  
IOP = Quiescent Current Consumed by the  
Charger IC for Normal Operation  
Next, the maximum operating ambient temperature  
for a given application can be estimated based on  
the thermal resistance of the 3x3mm TDFN pack-  
age when sufficiently mounted to a PCB layout and  
the internal thermal loop temperature threshold.  
First, the maximum power dissipation for a given  
situation should be calculated:  
TA = TJ - (θJA  
· PD)  
Eq. 5:  
PD = [(VIN - VBAT) · ICC + (VIN · IOP)]  
Eq. 4:  
18  
3688.2006.10.1.5  
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