Advanced Analog Technology, Inc.
AAT1015
PACKAGE DIMENSION (CONT.)
SYMBOL
A
A1
A2
B
B1
B2
C
D
E
E1
e
L
eB
S
DIMENSION IN MILLIMETERS
MIN
TYP
MAX
3.6
3.9
4.2
0.38
-----
-----
3.25
3.30
3.45
0.36
0.46
0.56
1.400
1.524
1.650
0.813
0.990
1.170
0.20
0.25
0.33
9.12
9.30
9.53
7.62
7.87
8.26
6.20
6.35
6.60
-----
2.54
-----
3.18
-----
-----
8.38
-----
9.40
0.71
0.84
0.97
MIN
0.142
0.015
0.128
0.014
0.055
0.032
0.008
0.359
0.300
0.244
-----
0.125
0.330
0.028
DIMENSION IN INCHES
TYP
0.154
-----
0.130
0.018
0.060
0.039
0.010
0.366
0.310
0.250
0.100
-----
-----
0.033
MAX
0.165
-----
0.136
0.022
0.065
0.046
0.013
0.375
0.325
0.260
-----
-----
0.370
0.038
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. LEAD FRAM MATERIAL: C194.
3. PACKAGE DIMENSION EXCLUDE MOLDING FLASH.
4. AFTER SOLDER PLATING, LEAD THICKNESS WILL BE 0.013” MAX.
5. AFTER SOLDER DIPPING, LEAD THICKNESS WILL BE 0.020” MAX.
6. THE MAX. ALLOWABLE MOLDING FLASH IS 0.010”.
7. TOLERANCE: 0.010” UNLESS OTERWISE SPECIFIED.
8. OTHERWISE DIMENSION FOLLOW ACCEPTABLE SPECS.
9. THE BOTTOM
E
−
PIN INDENT IS MARKED AS BELOW.
10. PACKAGE DIMENSION IS IN COMPLIANCE WITH JEDEC STANDARD MS-001 AB JUL85’ ISSUE B.
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