ECB-970
Qseven Rev. 2.0 Carrier Board for ARM/X86 Solutions
Features
■
■
Supports
Launching in Q2
Qseven Module
■
■
Support ARM/x86 Based
■
■
Supports Gigabit Ethernet, RJ-45
■
■
Up to 24-bit Dual Channel LVDS Connector or EDP, DP or HDMI
■
■
High Definition Audio or I2S Audio Interface
■
■
SATA Port x 2, SDIO x 1
■
■
USB 2.0 x 8, USB 3.0 x 2, USB OTG
■
■
LPC Connector x 1
■
■
Qseven 2.0
■
■
9.65” Form Factor
Specifications
System
Form Factor
I/O Chipset
Ethernet
Expansion Interface
Power Requirement
Power Consumption
(Typical)
Board Size
Gross Weight
Operation Temperature
Storage Temperature
Operation Humidity
MTBF (Hours)
Display
LCD Interface
I/O
Storage
Serial Port
Parallel Port
USB
PS/2 Port
I2C
Audio
Debug LED
MTX
Winbond W83627DHG-P or Fintek F81866 (optional)
10/1000/1000Base-TX, RJ-45 x 1 (From CPU module)
PCI Express [x4] x 1, LPC Connector x 1 (For Super I/O Card only)
+5V DC
—
9.65" x 9.65" (243.84mm x 243.84mm)
1.32 lb (0.6 Kg)
32°F ~ 140°F (0°C ~ 60°C)
-40°F ~ 185°F (-40°C ~ 85°C)
0% ~ 90% relative humidity, non-condensing
—
LVDS or EDP, DP or HDMI
Up to 24-bit dual channel LVDS
—
SATA x 2, SDIO x 1
RS-232 x 1, RS-232/422/485 x 1
—
USB 2.0 x 8, USB3.0 x 2, USB OTG
—
1
Audio Jack, supports Line-in, Line-out, Microphone, Headphone (ARM base only)
—
Packing List
•
Product CD
•
ECB-970
09-4
AAEON [ AAEON TECHNOLOGY ]
