IMP51 1 1/51 1 2
Pin Configuration
SO-16
T7
T8
T9
HEAT SINK/GND
GND
DISCONNECT*
T1
T2
1
2
3
4
5
6
7
8
DW Package
IMP5111
IMP5112
16 T6
15 T5
14 NC
13 HEAT SINK/GND
12 HEAT SINK/GND
11 V
TERM
10 T4
9
T3
T7
T8
T9
NC
GND
HEAT SINK/GND
HEAT SINK/GND
HEAT SINK/GND
HEAT SINK/GND
5111/5112__02.eps
TSSOP-24
1
2
3
4
5
6
7
8
9
IMP5111
IMP5112
24 T6
23 T5
22 NC
21 NC
20 HEAT SINK/GND
19 HEAT SINK/GND
18 HEAT SINK/GND
17 HEAT SINK/GND
16 NC
15 V
TERM
14 T4
13 T3
PW Package
5111/5112_02a.eps
* DISCONNECT (IMP5111)
DISCONNECT (IMP5112)
DISCONNECT* 10
T1 11
T2 12
* DISCONNECT (IMP5111)
DISCONNECT (IMP5112)
Ordering Information
Part Number
IMP5111CDP
IMP5111CDPT
IMP5111CPWP
IMP5111CPWPT
IMP5112CDP
IMP5112CDPT
IMP5112CPWP
IMP5112CPWPT
Temperature Range
0°C to 125°C
0°C to 125°C
0°C to 125°C
0°C to 125°C
0°C to 125°C
0°C to 125°C
0°C to 125°C
0°C to 125°C
Package
16-pin Plastic SO
Tape and Reel, 16-pin Plastic SO
24-pin Plastic TSSOP
Tape and Reel, 24-pin Plastic TSSOP
16-pin Plastic SO
Tape and Reel, 16-pin Plastic SO
24-pin Plastic TSSOP
Tape and Reel, 24-pin Plastic TSSOP
5111/5112_t01.at3
Absolute Maximum Ratings
1
TermPwr Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . +7V
Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . 0V to +7V
Regulator Output Current . . . . . . . . . . . . . . . . . . 0.4A
Operating Junction Temperature
Plastic (DP, PWP Packages) . . . . . . . . . . . . . . . 150°C
Storage Temperature Range . . . . . . . . . . . . . . . . . -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) . . . . . 300°C
Note: 1. Exceeding these ratings could cause damage to the device. All
voltages are with respect to Ground. Currents are positive
into, negative out of the specified terminal.
Thermal Data
DP Package:
Thermal Resistance Junction-to-Leads,
θ
JL
. . . . . . . . 20°C/W
Thermal Resistance Junction-to-Ambient,
θ
JA
. . . . . . 50°C/W
PW Package:
Thermal Resistance Junction-to-Leads,
θ
JL
. . . . . . . . 27°C/W
Thermal Resistance Junction-to-Ambient,
θ
JA
. . . . . . 100°C/W
2
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal performance of the
device/pc-board system. All of the ambient airflow is assumed.
408-432-9100/www.impweb.com
© 2002 IMP, Inc.
A1PROS [ A1 PROS CO., LTD. ]
