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• RoHS Compliant
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Underplating: 100 µ" [ 2.54 µm ]
Nickel
Current Rating: 0.5 A
Temperature Rating: -55°C to +105°C
Tripolarized Wiremount Sockets,
.050" x .100"
Version Available
• 20-100 Positions
• Rugged Tri-Polarized
Mating System
• High Performance
Hill-n-Dale IDC Interface
• Metal Cover Latch
Series 82
• Optional Metal Strain Relief
• Compatible with PVC, TPE and FEP
Cable Insulations
U-Slot: Matte Tin (RoHS compliant)
or Tin-Lead
Wiping Area: 30 µ" [ 0.76 µm ]
Gold
• RoHS Compliant
Contact
Material: Copper Alloy
Insulation
Material: High Temperature Plastic
Flammability UL 94V-0
Plating
Current Rating: 0.5 A
Temperature Rating: -55°C to +105°C
4-Wall, Tripolarized Headers,
.050" x .100"
Version Available
• 20-100 Positions
• Straight and Right Angle
• Vertical SMT Option
• High Temperature
Series 81
Wiping Area: 30 µ" [ 0.76 µm ]
Gold
Underplating: 100 µ" [ 2.54 µm ]
Nickel
• RoHS Compliant
• 10-64 Positions
Contact
Material: Beryllium Copper
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Current Rating: 1 A
Temperature Rating: -55°C to +105°C
PCB 2-Row,
.100" x .100"
Series 78
• Low Profile
• 2.8 or 3.8 mm Tail Options
Underplating: 100 µ" [ 2.54 µm ] Nickel
U Slot and Solder Tails: Gold Flash
• RoHS Compliant
Version Available
• 10-50 Positions
• Low Profile Design
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Current Rating: 1 A
Temperature Rating: -55°C to +120°C
PCB 4-Row,
.100" x .100"
Series 3400
Underplating: 100 µ" [ 2.54 µm ]
Nickel, Class 2
U-Slot and Solder Tails: 10 µ"
[0.25 µm] Gold
or 200 µ" [5.08 µm] Tin Lead
3M.com/interconnects
11
3M [ 3M ELECTRONICS ]
