1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC) ...................................................................... -0.3 V dc to +6.25 V dc
Storage temperature range...................................................................... -65°C to +150°C
Maximum power dissipation (PD).............................................................. 1.0 W
Lead temperature (soldering, 10 seconds) .............................................. +300°C
Junction temperature (TJ) 2/.................................................................... +175°C
Thermal resistance, junction-to-case (ΘJC) .............................................. See MIL-STD-1835
Input voltage range (VIL, VIH).................................................................... -0.3 V dc to +6.25 V dc
Data retention........................................................................................... 10 years (minimum)
Endurance:
Device types 01 through 04, 06 through 26, and 28 ............................. 10,000 cycles/byte (minimum)
Device types 05 and 27.......................................................................... 100,000 cycles/byte (minimum)
Chip clear voltage (VH)............................................................................. 13.0 V dc
1.4 Recommended operating conditions. 1/
Supply voltage range (VCC) ...................................................................... +4.5 V dc to +5.5 V dc
Case operating temperature range (TC)................................................... -55°C to +125°C
Input voltage, low range (VIL) ................................................................... -0.1 V dc to +0.8 V dc
Input voltage, high range (VIH) ................................................................. +2.0 V dc to VCC +0.3 V dc
Chip clear voltage range (VH)................................................................... 12 V dc to 13 V dc
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 -- Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -- List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from
the Standardization Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
1/ All voltages are referenced to VSS (ground).
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
3
DSCC FORM 2234
APR 97
XICOR [ XICOR INC. ]
