WJZ2020
Broadband Surface Mount Mixer
Mechanical Information
This package is lead-free/RoHS-compliant. The plating material is lead-free Tin (Sn).
It is compatible with lead-free (maximum 260qC reflow temperature) and recommend 245qC reflow temperature soldering processes.
Also recommend adding active flux of 2% during solder reflow
Application Circuit
WJZ2020
PIN 8
PIN 4
LO
PIN 6
RF
IF
Notes:
1. Circuit board material: .021” FR-4, 2 layers, .025” total thickness
2. Blocking capacitors are required on the ports (pins 4., 6, 8) if any dc signal is present.
Outline Drawing
Product Marking
The component will be marked with a
“WJZ2020” designator followed by an
alphanumeric lot code on the top surface of
the package.
WJZ2020
XXXX
Tape and reel specifications for this part will
be located on the website in the “Application
Notes” section.
Functional Pin Layout
1
2
3
Land Pattern / Mounting Configuration
LO 8
4 RF
7
6
IF
5
Top view
Pin No.
4
6
8
1,2,3,5,7
Backside Metal
Notes:
1. Ground vias are critical for RF grounding considerations.
2. A minimum of 12 ground vias underneath the device is required.
3. Trace width depends on the PC board material and thickness
Function
RF
IF
LO
GND
Specifications and information are subject to change without notice
WJ Communications, Inc
x
Phone 1-800-WJ1-4401
x
FAX: 408-577-6621
x
e-mail: sales@wj.com
x
Web site: www.wj.com
Page 3 of 3 April 2007
WJCI [ WJ COMMUNICATION. INC. ]
