The Communications Edge TM
VG025
High Linearity Variable Gain Amplifier
Product Information
VG025-G Mechanical Information
This package is lead-free/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded (maximum
245°C reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
Outline Drawing
Product Marking
The component will be marked with
a
“VG025-G” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part will be
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
Passes ꢀ500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Test:
Standard:
Passes ꢀ1000V to <2000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Mounting Configuration / Land Pattern
MSL:
Level 2 @ 260 ˚C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Pin Layout
16
15
14
13
RF OUT
N/C
12
11
10
9
1
2
3
4
N/C
N/C
N/C
Interstage
Match
N/C
RF IN
5
6
7
8
Function
Pin No
RF Input
Gain Control
4
8
Interstage Match
RF Output / DC bias
6, 10
12
No Connect or GND All other pins
Ground Backside slug
Thermal Specifications
MTTF vs. GND Tab Temperature
1000
Parameter
Rating
-40 to +85 °C
59 °C / W
129 °C
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
100
10
1
1. The thermal resistance is referenced from the hottest part of the
junction to the backside ground copper tab.
2. This corresponds to the typical biasing condition of +5V, 150 mA at
an 85° C case temperature. A minimum MTTF of 1 million hours is
achieved for junction temperatures below 160° C.
60
70
80
90
100
110
Tab Temperature (°C)
Specifications and information are subject to change without notice
Page 7 of 7 January 2006
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
WJCI [ WJ COMMUNICATION. INC. ]
