SME1400B-10
Broadband Surface Mount Mixer
SME1400B-10F Mechanical Information
This package is RoHS-compliant. The plating material on the leads is AgPdPt. It is compatible with both lead-free (maximum 260
°C
reflow temperature) and leaded (maximum 245
°C
reflow temperature) soldering processes
Application Circuit
SME1400B-10F
PIN 8
PIN 4
LO
PIN 6
RF
IF
Notes:
1. Circuit board material: .014” FR-4, 4 layers, .062” total thickness
2. Blocking capacitors are required on the ports (pins 2, 5, 7) if any dc signal is present.
Outline Drawing
Product Marking
The component will be marked with an
“SME1400B-10F” designator followed by an
alphanumeric lot code on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Information
ESD Classification:
Value:
Test:
Standard:
ESD Classification:
Value:
Test:
Standard:
Class 1C
Passes 1000V to <2000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes 1000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Land Pattern / Mounting Configuration
Functional Pin Layout
1
2
3
LO 8
4 RF
7
6
IIF
5
Notes:
1. Ground vias are critical for RF grounding considerations.
2. A minimum of 12 ground vias underneath the device are required.
3. Trace width depends on the PC board material and thickness.
Pin No.
4
6
8
1, 2, 3, 5, 7
Backside Metal
Function
RF
IF
LO
GND
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 5 of 5 May 2007
WJCI [ WJ COMMUNICATION. INC. ]
