SCG015
The Communications Edge
TM
Product Information
¼ Watt, High Linearity InGaP HBT Amplifier
SCG015B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an “S015G”
designator with an alphanumeric lot code on the
top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application Notes”
section.
ESD / MSL Information
Land Pattern
ESD Rating: Class 1B
Value:
Passes at between 500 and 1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the region
where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
MTTF vs. GND Tab Temperature
100000
Rating
-40 to +85
°C
128
°C
/ W
149
°C
10000
Notes:
1. The thermal resistance is referenced from the
junction-to-case at a case temperature of 85° C.
2. This corresponds to the typical biasing condition of
+5V, 100 mA at an 85° C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247° C.
Tjc = Tcase + Rth * Vde * Icc
1000
100
60
70
80
90
100
110
120
Tab Temperature (°C)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 6 of 6
June 2005 Rev. 1
WJCI [ WJ COMMUNICATION. INC. ]
