欢迎访问ic37.com |
会员登录 免费注册
发布采购

ML401-PCB 参数 Datasheet PDF下载

ML401-PCB图片预览
型号: ML401-PCB
PDF下载: 下载PDF文件 查看货源
内容描述: 1.7-2.2 GHz高IP3混频器,集成LO放大器 [1.7-2.2 GHz High IP3 Mixer with Integrated LO Amp]
分类和应用: 放大器
文件页数/大小: 4 页 / 301 K
品牌: WJCI [ WJ COMMUNICATION. INC. ]
 浏览型号ML401-PCB的Datasheet PDF文件第1页浏览型号ML401-PCB的Datasheet PDF文件第2页浏览型号ML401-PCB的Datasheet PDF文件第3页  
ML401
The Communications Edge
TM
Product Information
1.7–2.2 GHz High IP3 Mixer with Integrated LO Amp
ML401-G Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
°C
reflow temperature) and lead (maximum 245
°C
reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be lasermarked with a
“ML401-G”
product
label
with
an
alphanumeric lot code on the top surface of the
package.
Tape and reel specifications for this part will be
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes 1000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Pin Layout
Mounting Configuration / Land Pattern
LO
1
8
RF
7
GND
6
GND
5
IF
The backside paddle is Ground.
GND
2
Vcc1
3
Vcc2
4
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill
and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. All dimensions are in millimeters (inches). Angles are in degrees.
5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and construction.
7. Use 1 oz. Copper minimum.
Pin
1
2
3
4
5
6
7
8
Function
LO
GND
Vcc1
Vcc2
IF
GND
GND
RF
Backside paddle is RF and DC ground.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
Rating
-40 to +85
°C
104
°C
/ W
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 4 of 4 June 2006