FH101
High Dynamic Range FET
FH101-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260qC reflow temperature) and leaded (maximum 245qC reflow temperature) soldering processes.
Outline Drawing
Product Marking
The FH101-G will be marked with an “FH1G”
An alphanumeric lot code
designator.
(“XXXX-X”) is also marked below the part
designator on the top surface of the package. A
“1” will be lasermarked in the upper right-hand
corner.
The obsolete tin-lead package is
marked with an “FH1” designator followed by
an alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
Land Pattern
MSL / ESD Rating
ESD Rating: Class 1B
Value:
Test:
Standard:
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Test:
Standard:
Passes 1000V to <2000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
MTTF vs. GND Tab Temperature
Thermal Specifications
1000
100
10
Parameter
Rating
-40 to +85qC
59 qC / W
126 qC
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
1
+5V, 140 mA at an 85 C case temperature.
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 C.
A
7. All dimensions are in millimeters (inches). Angles are in degrees.
60
70
80
90
100
110
Tab Temperature (°C)
Specifications and information are subject to change without notice.
Web site: www.wj.com Page 7 of 7 April 2007
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
WJCI [ WJ COMMUNICATION. INC. ]
