1 Watt, High Linearity InGaP HBT Amplifier
ECP103
The Communications Edge
TM
Product Information
ECP103D (16-pin 4x4mm Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“ ECP103D” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
§
Land Pattern
Vbias
N/C
14
GROUND PLANE AREA FOR VIAS
2.23mm X 2.23mm
DEVICE GROUND PAD
2.0mm X 2.0mm
RECOMMENDED PAD
0.76mm X 0.34mm
SOLDERMASK SWELL TO BE 0.5mm
FROM OUTSIDE EDGE OF ALL PADS
TYP.
4.00mm
Vref 1
N/C 2
RF IN 3
N/C 4
16
N/C
15
N/C
13
12 N/C
11 RF OUT
10 RF OUT
9 N/C
8
N/C
0.65mm
TYP.
0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE PLACED
ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO TOP,
BOTTOM, AND INTERNAL GROUND PLANES IN ORDER TO
MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MATERIAL,
VIA BARREL PLATING TO BE MIN. 0.0014 THICK. VIAS TO BE
PLUGGED WITH EITHER CONDUCTIVE OR NON-CONDUCTIVE
EPOXY TO PREVENT SOLDER. DRAINS THROUGH VIA IN
REFLOW PROCESS
MSL Rating: Level 3 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Diagram
5
N/C
6
N/C
7
N/C
16L 4.0mm X 4.0mm PACKAGE
Thermal Specifications
MTTF (million hrs)
MTTF vs. GND Tab Temperature
1000000
100000
10000
1000
100
50
60
70
80
90
100
3.
4.
5.
6.
7.
8
2.
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
§
Rating
-40 to +85q C
33q C / W
159q C
Function
Vref
RF Input
RF Output
Vbias
GND
N/C or GND
Pin No.
1
3
10, 11
16
Backside Padd
2, 4-9, 12-15
Mounting Config. Notes
1.
A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25
mm (.010” ).
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
All dimensions are in millimeters (inches). Angles are in
degrees.
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85 C. Tjc is a function
of the voltage at pins 10 and 11 and the current applied
to pins 10, 11, and 16 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
450 mA at an 85 C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247 C.
§
§
Tab temperature (° C)
Specifications and information are subject to change without notice
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WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
October 2004 Rev 1
WJCI [ WJ COMMUNICATION. INC. ]
