�½ Watt, High Linearity InGaP HBT Amplifier
ECP052D
The Communications Edge
TM
Product Information
ECP052D-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
°C
reflow temperature) and leaded
(maximum 245
°C
reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
Outline Drawing
Product Marking
The component will be marked with an
“E052G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“ECP052D” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
E052G
ESD / MSL Information
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 2 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1.
2.
A heatsink underneath the area of the PCB for the mounted
device is recommended for proper thermal operation.
Damage to the device can occur without the use of one.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
All dimensions are in millimeters (inches). Angles are in
degrees.
3.
4.
5.
6.
7.
8.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tj
(2)
MTTF vs. GND Tab Temperature
100000
-40 to +85
°C
62
°C
/ W
162
°C
Notes:
1. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85
°C.
Tj is a function of the voltage at pins 10 and 11 and
the current applied to pins 10, 11, and 16 and can be calculated by:
Tj = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V, 250 mA at an 85
°C
case temperature. A minimum MTTF of 1 million hours is achieved for
junction temperatures below 247
°C.
MTTF (million hrs)
Rating
10000
1000
100
60
70
80
90
100 110
Tab Temperature (°
C)
120
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 4 of 4
April 2006
WJCI [ WJ COMMUNICATION. INC. ]
