ECG055
The Communications Edge
TM
Product Information
InGaP HBT Gain Block
ECG055C (SOT-86 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with a two-
digit numeric lot code followed by a “ Y”
designator on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
¢
MSL Rating: Level 1 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Land Pattern
1. Ground / thermal vias are critical for the proper
performance of this device.
Vias should use
a .35mm (#80 / .0135” ) diameter drill and have a
final plated thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC
board in the region where the board contacts the
heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles
are in degrees.
Specifications and information are subject to change without notice
£
£
£
£
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004
WJCI [ WJ COMMUNICATION. INC. ]
