AH31
High Dynamic Range IF Amplifier
Product Information
Outline Drawing
Product Marking
The component will be marked with an “AH31”
designator with a four-digit alphanumeric lot code
on the top surface of the package. Tape and reel
specifications for this part is located on the website
in the “Application Notes” section.
Land Pattern
ESD / MSL Information
ESD Classification:
Value:
Test:
Standard:
ESD Classification:
Value:
Test:
Standard:
MSL Rating:
Standard:
Class 1B
Passes at 600 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes at 1000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Level 3 at +225
°C
convection reflow
JEDEC Standard J-STD-020A
Mounting Configuration Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80/.0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577- 6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
February 2004
WJCI [ WJ COMMUNICATION. INC. ]
