AH312 / ECP200G
2 Watt, High Linearity InGaP HBT Amplifier
Product Information
AH312-S8G (Lead-Free Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260°C reflow temperature) and lead (maximum 245°C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“AH312-S8G” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Standard:
MSL Rating: Level 2 at +260° C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted device
is strictly required for proper thermal operation. Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
Mounting Configuration / Land Pattern
4. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
MTTF vs. GND Tab Temperature
Parameter
Rating
100000
10000
1000
Operating Case Temperature
Thermal Resistance, Rth (1)
-40 to +85° C
17.5° C / W
155° C
Junction Temperature, Tjc (2)
Notes:
1. The thermal resistance is referenced from the hottest part
of the junction to the ground slug underneath the device.
2. This corresponds to the typical biasing condition of
+5V, 800 mA at an 85° C case temperature.
A
100
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247° C. Tjc is a function
of the voltage at pins 6 and 7 and the current applied
to pins 6, 7, and 8 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
60
70
80
90
100 110 120
Tab Temperature (°C)
Specifications and information are subject to change without notice.
Page 8 of 9 June 2005
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