AH215
The Communications Edge
TM
Product Information
1 Watt, High Linearity InGaP HBT Amplifier
AH215-S8G (Lead-Free Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
°C
reflow temperature) and lead (maximum 245
°C
reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“AH215G” designator with an alphanumeric lot
code on the top surface of the package. The
obsoleted tin-lead version will have been marked
with an “AH215-S8” or “ECP100G” designator.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 2 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Mounting Configuration / Land Pattern
1. A heatsink underneath the area of the PCB for the mounted device
is strictly required for proper thermal operation. Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Operating Case Temperature
Thermal Resistance
(2)
, Rth
Junction Temperature
(3)
, Tjc
(1)
MTTF vs. GND Tab Temperature
1000000
M T T F (m illio n h rs )
100000
10000
1000
100
50
60
70
80
90
100
Tab temperature (° C)
Parameter
Rating
-40 to +85
°C
33
°C
/ W
159
°C
Notes:
1. The amplifier can be operated at 105
°C
case temperature for up to 1000
hours over its lifetime without degradation in performance and will not
degrade device operation at the recommended maximum 85
°C
case
temperature for the rest of its lifetime.
2. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85
°C.
Tjc is a function of the voltage at pins 6 and 7 and
the current applied to pins 6, 7, and 8 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
3. This corresponds to the typical biasing condition of +5V, 450 mA at an
85°C case temperature. A minimum MTTF of 1 million hours is achieved
for junction temperatures below 247
°C.
Specifications and information are subject to change without notice.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 7 of 7 September 2005
WJCI [ WJ COMMUNICATION. INC. ]
