The Communications Edge TM
AH212
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
AH212-EG (Lead-Free DFN 4x5 mm Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is Matte Tin. It is compatible with both lead-free
(maximum 260 C reflow temperature) and lead (maximum 245 C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“AH212-EG” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
AH212-EG
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Mounting Configuration / Land Pattern
Value:
Test:
Passes ≥ 2000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Standard:
MSL Rating: Level 2 at +260 C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted device
is recommended for proper thermal operation. Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
Thermal Specifications
Parameter
Rating
-40 to +85 C
33 C / W
156 C
Operating Case Temperature
Thermal Resistance, Rth (1)
8. All dimensions are in millimeters
Junction Temperature, Tj (2)
Notes:
1. The thermal resistance is referenced from the junction-to-case at a case.
temperature of 85 C. Tj is a function of the voltage and the current applied. It can
be calculated by:
Functional Pin Layout
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V, 400 mA at an 85 C
case temperature.
Vbias1
Vcc1
1
2
3
4
12
11
10
9
N/C
N/C
RF In
N/C
Vcc2 / RF Out
Vcc2 / RF Out
N/C
N/C 5
8
Vbias2
N/C
6
7
Function
Vcc1
Pin No.
12
Input
3
Output /Vcc2
Vbias1
9, 10
1
Vbias2
6
GND
N/C or GND
Backside Paddle
2, 4, 5, 7, 8, 11
Specifications and information are subject to change without notice.
Page 12 of 12 August 2006
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
WJCI [ WJ COMMUNICATION. INC. ]
