The Communications Edge TM
AH212
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
AH212-S8G (Lead-Free SOIC-8 Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260 C reflow temperature) and lead (maximum 245 C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“AH212G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Test:
Standard:
Passes ≥ 2000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260 C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted device
is recommended for proper thermal operation. Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
Mounting Configuration / Land Pattern
4. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters
Functional Pin Layout
8
7
6
N/C
1
2
3
Vcc1
Vcc2 / RF Out
Vcc2 / RF Out
Vbias1
RF In
Thermal Specifications
Parameter
Rating
-40 to +85C
33 C / W
156 C
Operating Case Temperature
5
5
N/C
Vbias2
4
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
Function
Vcc1
Input
Output/ Vcc2
Vbias1
Vbias2
Pin No.
Notes:
1
3
1. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85 C. Tj is a function of the voltage and the current applied. It
can be calculated by:
Tj = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V, 400 mA at an 85 C
case temperature.
6, 7
2
4
Backside Paddle
5, 8
GND
N/C or GND
Specifications and information are subject to change without notice.
Page 11 of 12 August 2006
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
WJCI [ WJ COMMUNICATION. INC. ]
