�½ Watt, High Linearity InGaP HBT Amplifier
AH115
The Communications Edge
TM
Product Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
qC
reflow temperature) and leaded
(maximum 245
qC
reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
AH115-S8G (Green / Lead-free SOIC-8 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“AH115G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“AH115-S8”
or “ECP050G”
designator
followed by an alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
MSL Rating: Level 2 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135” ) diameter drill and
have a final plated thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board
material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance
(2)
, Rth
Junction Temperature
(3)
, Tjc
§
(1)
Notes:
1. The amplifier can be operated at 105 C case temperature for up to 1000
hours over its lifetime without degradation in performance and will not
degrade device operation at the recommended maximum 85 C case
temperature for the rest of its lifetime.
2. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85 C. Tjc is a function of the voltage at pins 6 and 7 and
the current applied to pins 6, 7, and 8 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
3. This corresponds to the typical biasing condition of +5V, 250 mA at an
85 C case temperature. A minimum MTTF of 1 million hours is achieved
for junction temperatures below 247 C.
§
§
§
§
-40 to +85
qC
62
qC
/ W
162
qC
MTTF (million hrs)
Rating
100000
MTTF vs. GND Tab Temperature
10000
1000
100
60
70
80
90 100 110
Tab Temperature (°C)
120
Specifications and information are subject to change without notice
¦
¦
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WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
©
¨
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Page 5 of 5
April 2006
WJCI [ WJ COMMUNICATION. INC. ]
