AH114
The Communications Edge
TM
Product Information
¼ Watt, High Linearity InGaP HBT Amplifier
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
qC
reflow temperature) and leaded
(maximum 245
qC
reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
AH114-89G (Green / Lead-free SOT-89 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an “AH114
G” designator with an alphanumeric lot code on
the top surface of the package. The obsolete tin-
lead package is marked with an “AH114” or
“E009” designator followed by an alphanumeric
lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1A
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
Land Pattern
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135” ) diameter drill and
have a final plated thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tj
(2)
¦
Rating
Notes:
1. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85 C.
2. This corresponds to the typical biasing condition of +5V, 150 mA at an 85
C case temperature. A minimum MTTF of 1 million hours is achieved
for junction temperatures below 247 C.
¦
¦
MTTF (million hrs)
-40 to +85
qC
149
qC
/ W
197
qC
1000.0
MTTF vs. GND Tab Temperature
100.0
10.0
1.0
60
70
80
90
100 110
Tab Temperature (°
C)
120
Specifications and information are subject to change without notice
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WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
§
Page 6 of 6 April 2006
WJCI [ WJ COMMUNICATION. INC. ]
