AH11
The Communications Edge
TM
Product Information
High Dynamic Range Dual Amplifier
AH11-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both
lead-free (maximum 260
°C
reflow temperature) and lead (maximum 245
°C
reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“AH11-G” designator with an alphanumeric
lot code on the top surface of the package.
The obsolete tin-lead package is marked with
an “AH11” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value
Test:
Standard:
Class 1B
Passes from 500 to 1000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes greater than 1000 V
Charge Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020A
Functional Pin Layout
Land Pattern
Pin
1
2
3
4
5
6
7
8
Function
RF input (Amp1 input)
Ground
Ground
RF input (Amp2 input)
RF output (Amp2 output)
Ground
Ground
RF output (Amp1 output)
The backside paddle is the Source and should be
grounded for thermal and electrical purposes.
Mounting Config. Notes
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tj
(2)
1.
Rating
-40 to +85
°C
28
°C/W
127
°C
MTTF vs. GND Tab Temperature
1000
2.
3.
4.
100
5.
Notes:
1. The thermal resistance is referenced from the hottest part
of the junction to ground tab underneath the device.
2. This corresponds to the typical biasing condition of +5V,
300 mA at an 85
°C
case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 160
°C.
10
6.
7.
8.
1
60
70
80
90
100
Tab Temperature (°C)
110
9.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80/.0135”)
diameter drill and have a final plated through diameter
of .25mm (.010”)
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal performance.
Otherwise ground vias should be placed as close to the land
pattern as possible.
All dimensions are in mm. Angles are in degrees.
MTTF (million hrs)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 5 of 6 May 2006
WJCI [ WJ COMMUNICATION. INC. ]
