AH101
The Communications Edge
TM
Product Information
Medium Power, High Linearity Amplifier
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
qC
reflow temperature) and leaded
(maximum 245
qC
reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
AH101-G (Green / Lead-free SOT-89 Package) Mechanical Information
Outline Drawing
Product Marking
The AH101-G will be marked with an
“101G” designator. An alphanumeric lot
code (“XXXX-X” ) is also marked below the
part designator on the top surface of the
package. The obsolete tin-lead package is
marked with an “AH101” designator
followed by an alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
Land Pattern
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1C
Passes 1000V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes 1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
©
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tj
(2)
Rating
1000
MTTF vs. GND Tab Temperature
-40 to +85
qC
25
qC
/ W
130
qC
100
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+9V, 200 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 C.
©
©
10
1
60
70
80
90 100 110
Tab Temperature (°
C)
120
Specifications and information are subject to change without notice
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WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 5 of 5
June 2006
WJCI [ WJ COMMUNICATION. INC. ]
